Semiconductor devices

Simulation & Analysis of a Hydrodynamic Model of Semiconductor Devices by a Finite Element Method;

半導體器件動力模型的有限元法仿真與分析

Research for incompetent sources of semiconductor devices which are not up to the standard in DPA;

半導體器件DPA不合格的根源研究

A Galerkin-MMOCAA scheme for a semiconductor device simulation behavior of a semiconductor device;

一類半導體器件模擬的Galerkin-MMOCAA方法

Accelerators simulation experiment on single event effects in semiconductor devices;

半導體器件單粒子效應的加速器模擬實驗

In order to improve the forward conduction characteristics of silicon semiconductor devices, a comprehensive study of the influences of boron diffusion, phosphorous diffusion, doping concentration distribution in P~+-P region of sintered Al-Mo electrode and the minority carrier life on the forward conduction characteristics is performed.

為提高硅半導體器件的正向導電特性,文中對器件濃硼擴散、磷擴散和燒結鋁電極后P~+-P區摻雜濃度分布、少子壽命等因素的影響進行了實驗研究。

They have extensive application prospect in fields such as high brightness light emitting diodes,short wavelength laser diodes,high performance UV detector,and high temperature,high frequency,large power semiconductor devices.

GaN具有禁帶寬度大、熱導率高、電子飽和漂移速度大和介電常數小等特點,在高亮度發光二極管、短波長激光二極管、高性能紫外探測器和高溫、高頻、大功率半導體器件等領域有著廣泛的應用前景。

Types,technical characteristics and applications of power semiconductor devices frequently used for locomotive and rolling stock now are presented.

介紹了目前在機車車輛變流器中常用的電力半導體器件的種類、技術特點及應用范圍,著重闡述了電力半導體器件冷卻技術、結構特點及其應用范圍,對我國機車車輛變流器冷卻技術的發展提出了一些觀點。

All of various new power semiconductor devices use infegrati on technology from the microelectronics and have achieved power integration.

功率半導體器件主要用來控制能源和負載之間的能量流,使這種控制有很高的精度,特別快的控制時間和很小的耗散功率。

The over-heat of power semiconductors is the main reason causing the failure of power supply,so it is necessary to well process heat design to enhance the reliability of power supply.

功率半導體器件廣泛應用于各種電源設備中。

fuse for protection of semiconductor device

保護半導體器件熔斷器

Technological Fundamentals of Semiconductor Device

半導體器件工藝原理

metal-oxide-semiconductor device

金屬－氧化物－半導體器件

semiconductor device parameter stability

半導體器件參數穩定性

Course Design of Semiconductor Devices

半導體器件課程設計

Physics of Semiconductor Devices

《半導體器件物理學》

" Heat sink of semiconductor devices--Heat sink, extruded shapes"

GB/T7423.2-1987半導體器件散熱器型材散熱器

Heat sink for power semiconductor device

GB/T8446.1-1987電力半導體器件用散熱器

Heat sink of semiconductor devices--Generic specification

GB/T7423.1-1987半導體器件散熱器通用技術條件

Simulation on Stable-state Thermal Resistance of Sinks for Power Semiconductor Devices using the ANSYS software

用ANSYS軟件包模擬半導體器件散熱器穩態熱阻

Semiconductor devices-Sectional specification for discrete devices

GB/T12560-1990半導體器件分立器件分規范(可供認證用)

Electrotechnical terminology--Power semiconductor device

GB/T2900.32-1994電工術語電力半導體器件

complementary metal oxide semiconductor device

互補金屬氧化物半導體器件

Gold wire for semiconductor devices lead bonding

GB/T8750-1997半導體器件鍵合金絲

Semiconductor devices--Part 6: Thyristors

GB/T15291-1994半導體器件第6部分晶閘管

enhancement MOS device

增強型金屬氧化物半導體器件

Rating systems for electronic tubes and semiconductor devices

GB/T5839-1986電子管和半導體器件額定值制

Power Supply Miniaturization and Application of Semiconductor Devices

電源的小型化與半導體器件的應用